产品分类
Reains 热固化底填胶膜是专利产品并荣获由美国国家标准和技术局颁发的创新奖,它是一种聚酯类薄膜具有良好的韧性、 阻隔性、 耐化学/燃料腐蚀及高温或低温熔融固化的特性。它具有热回流特性并能够在各种各样的材质表面,不同的光洁度和材料厚度下进行粘接。这种薄膜符合所有USP 第 VI类,FDA CFR 175.105、 177.168 和 177.2600 特别是 Rohs 和卤素等消费类产品对材料的要求。
Reains 热固化底填胶膜已经被应用于许多全球著名品牌手持设备产品以增强无铅焊接的可靠性, 它被用于BGA,CSP 和 Flex等元器件的粘接工艺,此产品能够 100%返工,是当前替代环氧基液态点胶工艺的最好方法,能够有效的降低生产成本特别是生产中的报废成本。
热固化底填胶膜产品
热固化底填胶膜的应用工艺
热固化底填胶膜的尺寸
Reains White I Underfilm Dimension |
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Reains Part Number |
Raw material Thickness |
T=Thickness mm |
Thickness tolerance mm |
W= Width mm |
Width tolerance mm |
L= Length mm |
Length tolerance mm |
Carrier Tape Packaging Per EIA 481D width and pitch |
RE-123718-01 |
10 mils |
0.254 |
±0.025 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-02 |
9 mils |
0.229 |
±0.025 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-03 |
8 mils |
0.205 |
±0.025 |
0.762 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-04 |
8 mils |
0.205 |
±0.025 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-05 |
6.5 mils |
0.165 |
±0.025 |
0.762 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-06 |
6.5 mils |
0.165 |
±0.025 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-07 |
16 mils |
0.406 |
±0.025 |
0.762 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-08 |
18 mils |
0.457 |
±0.025 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-09 |
20 mils |
0.508 |
±0.025 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-10 |
20 mils |
0.508 |
±0.025 |
0.762 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-11 |
12 mils |
0.305 |
±0.025 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-12 |
12 mils |
0.305 |
±0.025 |
0.762 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-13 |
6.5 mils |
0.165 |
±0.025 |
1.000 |
±0.051 |
5.000 |
±0.178 |
12mmx4mm |
RE-123718-14 |
6 mils |
0.152 |
±0.025 |
0.762 |
±0.051 |
3.000 |
±0.178 |
8mmx4mm |
RE-123718-15 |
6.5 mils |
0.165 |
±0.025 |
0.500 |
±0.051 |
3.000 |
±0.178 |
8mmx4mm |
RE-123718-16 |
6.5 mils |
0.165 |
±0.025 |
0.400 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-17 |
6.5 mils |
0.165 |
±0.025 |
0.762 |
±0.051 |
7.000 |
±0.178 |
16mmx4mm |
RE-123718-18 |
6 mils |
0.152 |
±0.025 |
0.762 |
±0.051 |
7.000 |
±0.178 |
16mmx4mm |
RE-123718-19 |
5 mils |
0.127 |
±0.013 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-20 |
5 mils |
0.127 |
±0.013 |
0.762 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-21 |
6.5 mils |
0.165 |
±0.025 |
0.500 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-22 |
6.5 mils |
0.165 |
±0.025 |
0.500 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-23 |
5 mils |
0.127 |
±0.013 |
0.500 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-24 |
5 mils |
0.127 |
±0.013 |
0.500 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-25 |
6.5 mils |
0.165 |
±0.025 |
0.762 |
±0.051 |
3.500 |
±0.178 |
12mmx4mm |
RE-123718-26 |
4 mils |
0.101 |
±0.013 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-27 |
4 mils |
0.101 |
±0.013 |
0.762 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-28 |
4 mils |
0.101 |
±0.013 |
0.500 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-29 |
4 mils |
0.101 |
±0.013 |
0.500 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-30 |
4 mils |
0.101 |
±0.013 |
0.500 |
±0.051 |
3.000 |
±0.178 |
8mmx4mm |
RE-123718-31 |
3 mils |
0.080 |
±0.013 |
0.762 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-32 |
3 mils |
0.080 |
±0.013 |
0.762 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-33 |
3 mils |
0.080 |
±0.013 |
0.500 |
±0.051 |
5.842 |
±0.178 |
12mmx4mm |
RE-123718-34 |
3 mils |
0.080 |
±0.013 |
0.500 |
±0.051 |
4.000 |
±0.178 |
12mmx4mm |
RE-123718-35 |
3 mils |
0.080 |
±0.013 |
0.500 |
±0.051 |
3.000 |
±0.178 |
8mmx4mm |
RE-123718-36 |
5 mils |
0.127 |
±0.013 |
0.500 |
±0.051 |
3.000 |
±0.178 |
8mmx4mm |
热固化底填胶应用的问题
1.问题: Reains 热固化底填胶的应用优势是什么?。
回答: Reains 热固化底填胶能够使用贴片机进行表面贴装并经过热回流炉完成融化及固化工艺,它能够100%返工,这种材料已经通过了Rohs及无卤的环境测试,能够有效的提高客户的生产效率并降低产品的生产及报废成本。
2.问题: Reains 热固化底填胶的融化温度是多少,能够浸润多少层锡球?
回答: Reains 热固化底填胶的融化温度为185 到192摄氏度,它能够浸润大约5到8层BGA底部锡球的深度,特别是现在0.4毫米间距的BGA。
3.问题: Reains 热固化底填胶能否返工,如何返工以及返工时间如何?
回答: 我们保证Reains 热固化底填胶可以100%返工且不会产生任何报废,返工过程十分简单,仅仅是加热,移除BGA等元器件,清洁BGA焊盘上的残锡及残胶,清洁后焊盘表面无任何残留且不会产生PCB的报废,全部的返工时间大约3分钟。
4.问题: Reains 热固化底填胶是否会影响BGA/CSP在回流焊中的焊接工艺?
回答: 不会, 当Reains 热固化底填胶融化时不会对BGA/CSP等元件的焊接产生任何影响。
5. 问题: 如何对Reains 热固化底填胶进行选择并进行用户测试?。
回答: 请将贵司BGA/CSP的尺寸参数发给我们, 我们会对其进行技术评估并将底填胶的尺寸,贴装方法及网版的开孔尺寸发给贵司, 同时我们也会为贵司提供适量的底填胶进行验证测试。